Semiconductor AOI

Modular Opto-Mechanical Integration

Pixel-level accuracy defined on demand

Pixel-Level Accuracy Matching Diagram

A flexible modular opto-mechanical architecture precisely matches cameras and lenses to deeply optimize resolving capability.

Resolution customized on demand:Flexible imaging configurations ensure the best match between system resolution and pixel size.
Optimized edge clarity:Effectively suppresses edge diffusion, bringing edge response closer to pixel-level precision.
Improved inspection reliability:Provides high-quality feature input for algorithms, making defect recognition more stable.

Sub-Micron Resolution Pixel-Level Accuracy

Microscopic Köhler Illumination Optimization

Consistent illumination uniformity across the full field

Eyeviatech provides modular optical imaging components and system-level integration support for this application. Please contact our engineering team for detailed configuration recommendations.

Illumination Uniformity Analysis (ImageJ Macro)

For uneven illumination and glare in large-field inspection, we provide a simplified Köhler illumination solution that creates a stable imaging foundation for AOI algorithms.

Field balancing:Combines multi-stage focusing and adjustable diaphragms to effectively reduce edge brightness falloff.
Glare suppression:Reduces stray-light interference from metal and wafer surfaces, making grayscale values more stable.
Precise recognition:Improves robustness and equipment throughput for sub-micron defect inspection.

Uniformity Deviation <3% Adjustable Aperture NA

High-Resolution Wide-Field Lens Module

High-Resolution Wide-Field Lens Module Diagram

①High-Resolution Wide-Field Lens Module

Large-sensor adaptation:Supports sensors up to 37 mm, compatible with high-performance line-scan or large-area cameras.
Multiple focal length options:A series of focal length options flexibly match different AOI field-of-view and resolution requirements.

②Microscopic Köhler Illumination Module

Optical axis collimation:Integrated multi-stage focusing ensures beam parallelism and illumination uniformity.
Active control:Equipped with an adjustable aperture diaphragm to precisely control light-source NA and optimize image contrast.

③Adjustable Beam-Splitting Module

Refraction calibration:Includes an offset adjustment mechanism to compensate optical refraction deviation and ensure optical-path coaxiality.
Spectral customization:Supports modular replacement of beam-splitting components and excitation/cutoff filter assemblies, compatible with fluorescence and specific-band inspection.

④Apochromatic Objective Module

Apochromatic design:Reduces chromatic dispersion to ensure edge sharpness in multispectral imaging.
LWD series:Long working distance provides sufficient mechanical clearance.
HR series:High-NA design optimized for ultimate resolution over wide fields.

Standard Integrated System Specification Reference

For your semiconductor inspection projects, we can provide high-resolution microscope lenses, microscopy/industrial cameras, dedicated microscopy illumination, multi-dimensional precision adjustment stands, and other imaging components. We can also build modular microscopy imaging systems according to user needs, integrating fluorescence, polarization, dark field, DIC, autofocus, multi-objective switching, and other functional modules.

Semiconductor AOI High-Precision Microscopic Opto-Mechanical Module Specifications	Camera		Line-scan and area-scan CCD, 2/3", 1", 4/3", 32 mm or larger sensor formats
	Lens	Fixed-Magnification Lens	0.5x、0.55x、0.8x、1x、1.1x、1.6x、2x
		Manual / Motorized Zoom Lens	6:1(0.7x~4.5x)、7:1(0.64x~4.5)、12:1(0.58x~7x)
	Objective Modules	Ultra-Long Working Distance Objective	0.25x、0.5x、1.5x、2x
		Long Working Distance Objective	1x/2x/5x/7.5x/10x/20x/50x/100x
		Wide-Field Ultra-Clear Objective	2x/4x/6x/10x/20x/50x
	Illumination Module		Coaxial illumination, collimation-adjustable coaxial illumination, ring illumination, transmitted backlight, dark-field illumination, Köhler illumination
	Functional Modules		Polarization, DIC, autofocus, and photoluminescence (PL) options
	Optical Magnification		~1100x
	Resolution Range		~0.3μm
	Available Imaging Bands		NUV、VIS、NIR、SWIR、VIS-SWIR

Modular Wide-Field Microscopic Opto-Mechanical System Integration Cases

The following integration cases show applications of our modular wide-field microscopic opto-mechanical system. Through the coordinated design of optical lenses, objectives, illumination, autofocus, and other functional modules, the system achieves flexible integration of high resolution and uniform illumination for a variety of AOI inspection needs.

Wide-Field HR Uniform-Field Microscopy

A wide-field high-resolution tube lens integrates a simplified Köhler illumination module and high-NA HR objective, achieving sub-micron resolution and uniform illumination while maintaining a large field of view. It is suitable for wide-field high-precision AOI inspection.

Multi-Magnification Uniform-Field Autofocus

A wide-field high-resolution tube lens integrates angle-mounted Köhler illumination, an autofocus module, and linear automatic objective switching to enable multi-magnification imaging and autofocus, improving AOI inspection efficiency and reducing system debugging complexity.

Wide-Field Dual-Depth Microscopy

This solution uses a wide-field dual-optical-path design to enable synchronized dual-focal-plane imaging. It supports high-aspect-ratio TGV inspection and precise analysis of upper/lower hole offset and through-hole alignment.

Wide-Field DIC Autofocus

A wide-field high-resolution tube lens integrates an autofocus module and DIC module. It supports sub-micron morphology characterization of highly warped SiC etched wafers, accurately identifies BPD/TSD/TED dislocations, and supports automated full-wafer EPD defect-density statistics.

System Integration Application Case References

Bright/Dark-Field Broadband Object Imaging System:High-contrast detection of wafer scratches, particle contamination, metal residue, and tiny defects for defect recognition on wafer surfaces and scribe-line areas.
Photoluminescence Microscopy Imaging System:Detects wafer material defects, carrier recombination characteristics, and material uniformity.
Wide-Field Autofocus Microscopy Imaging System:Maintains optimal imaging focus in real time during wafer scanning, improving imaging stability and inspection efficiency in large-area and high-speed AOI inspection.
Autofocus DIC Microscopy Imaging System:Provides sub-micron morphology characterization of SiC etched wafers, accurately identifies BPD/TSD/TED dislocations, and supports automated full-wafer EPD statistics, offering important information for semiconductor mass-production evaluation and defect analysis.
SWIR Microscopy Imaging System:Non-destructive detection of wafer internal structures, package internal defects, hidden cracks, and related issues.
Dual-Field / Dual-Depth Microscopy Imaging System:Combines rapid macro-area wafer positioning with fine micro-defect inspection; supports high-aspect-ratio TGV inspection and precise analysis of upper/lower hole offset and through-hole alignment.